Discover a vast selection of Development kits for data transmission electronic components on T-Circles. Top electronic components from industry leading manufacturers such as Digilent, Mikroe, MEIG SMART TECHNOLOGY, R&D SOFTWARE SOLUTIONS, ORIGINGPS, CAVLI WIRELESS INCORPORATED, Seeed Studio, Telit, Simcom, RADIOCONTROLLI, Raytac Corporation, WIZnet, Nordic Semiconductors, IQRF TECH, ECCEL.
Uncover Top Categories
• Data Converter ICs
• Diodes & Rectifiers
• Memory Ics
• Transistors
• Audio & Video Connectors
• Card Edge Connectors
• D-Sub Connectors
• Headers & Wire Housings
• Capacitors
• Current Sense Resistors
• Film Resistors
• Wirewound Resistors
• DC/DC Converters
• Plug-In AC Adapters
• Power Supplies
• Transformers
• Cables
• Power
• Switches
• Terminal Blocks
• LED Bulbs & Modules
• LED Emitters
• LED Indication
• LED Lighting Electronics
SE868K5-DR (LP) EVK GNSS
Dev.kit: evaluation; GPS/GNSS antenna,USB cable
Category
Development kits for data transmission
Mfr Part #
Mfr
Telit
Life Cycle
XYZMIOT209#BC95G-UFL-1100000
Dev.kit: Microchip ARM; IoT; xyz-mIOT; NB-IoT; 35x45mm
R&D SOFTWARE SOLUTIONS
ORG2101-CMUS-T-EVK
Dev.kit: evaluation; LTE CAT M; 300kbps; GNSS,LTE Cat M1
ORIGINGPS
AVAILABLE_WHILE_STOCKS_LAST
ORG2101-C1US-T-EVK
Dev.kit: evaluation; LTE CAT 1; 10.3Mbps; GNSS,LTE Cat 1
ORG2101-3GUS-T-EVK
Dev.kit: evaluation; HSPA; 7.2Mbps; 3G,GNSS; 3.3÷4.5VDC
ORG2101-2GGL-T-EVK
Dev.kit: evaluation; GSM; 85.6kbps; 2G,GNSS; 3.3÷4.5VDC
ORG1518-MK06-UAR
Dev.kit: evaluation; Comp: ORG1518-MK06
ORG1518-R01-UAR
Dev.kit: evaluation; Comp: ORG1518-R01
FN990A40 INTERF. TLB REV.B W ENG2 MODULE
Dev.kit: LTE; Comp: FN990A40; 30x52x2.25mm; module
POWER PROFILER KIT II
Dev.kit: evaluation; holder,prototype board; power board
Nordic Semiconductors
XYZMIOT209#NOMODEM-000-1100000
Dev.kit: Microchip ARM; Comp: ATSAMD21G18A,DRV5032,HDC2010; IoT
XYZMIOT209#M95FA-UFL-0000000
Dev.kit: Microchip ARM; Comp: ATSAMD21G18A,Quectel M95FA; IoT
XYZMIOT209#BC95G-UFL-0000000
Dev.kit: Microchip ARM; Comp: ATSAMD21G18A,Quectel BC95G; IoT
XYZMIOT209#BG96-UFL-0000000
Dev.kit: Microchip ARM; Comp: ATSAMD21G18A,Quectel BG96; IoT
XYZMIOT209#NOMODEM-000-0000000
Dev.kit: Microchip ARM; Comp: ATSAMD21G18A; IoT; xyz-mIOT; 35x45mm
XYZMIOT209#M95FA-UFL-1100100
Dev.kit: Microchip ARM; IoT; xyz-mIOT; GSM/GPRS; 35x45mm
USB-QUAD08
Module: data acquisition; Resolution: 48bit; I/O: 8
Digilent
ME310G1-W1 INTERFACE TLB
Dev.kit: LTE; adapter; Comp: ME310G1-W1; 100x107x25mm
LTE CAT M / NB IOT WITH GNSS - PCB BOARD
Module: LTE; 1.8÷5.5VDC; THT; -40÷85°C; Transmission: LTE Cat.M1
ONLY_FOR_SPECIAL_ORDER
USB-2408-2AO
Module: data acquisition; Resolution: 24bit; Sampling: 1ksps
WE310G4-I ENG EVK
Dev.kit: evaluation; Comp: WE310G4-I/P
NEW
USB-1808X-OEM
Module: data acquisition; Resolution: 18bit; I/O: 4; Analog in: 8
MDBT42Q-AT2-UART-S
Module: Bluetooth Low Energy; Bluetooth: 5.0,5.1,5.2,5.4; AES128
Raytac Corporation
C16QS-EVK-V2-04
Dev.kit: LTE
CAVLI WIRELESS INCORPORATED
C16QS-EVK-V2-07
Dev.kit: LTE; Features: eSIM
Upload
BOM